Recon-RF has a dedicated manufacturing facility enabling rapid RF-Product developments for prototyping and low to high volume productions.
Assembly and Manufacturing Equipment and Machinery
Automated Wire/Ribbon Bonders
Die-to-Die/ Substrate-to-Die interconnect wire bonding and gold bumping
Finetech Pick and Place Machines
Pick-and-Place, eutectic die attach, flip-chip attach, and thermo-sonic bonding, with accuracy to +/- 5 um.
Precision Epoxy Dispensing Machines
Automated precision adhesive dispenser for precision placement of conductive adhesives for die/ substrate attach
High Magnification Inspection Scopes
High precision inspection of assemblies, bond profile inspection, and creation of 3D models for verification of structures - with an accuracy down to 2 um
Reflow soldering of surface mount electronic components to printed circuit boards and curing of conductive epoxy
Additional Assembly and Manufacturing Equipment
Recon-RF has a wide variety of machinery and equipment to enable rapid product development - from design to assembly